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  • This unique Leap wireless sensor attaches to the top of a silicon wafer for fabrication process monitoring. It is less than 5mm thick, so it fits in wafer processing ovens and other critical fab equipment. The sensor has 9 ultra-small, high-accuracy RTD sensors that are adhered to the surface of the wafer, giving you better accuracy than a wireless thermocouple wafer sensor (tc wafer sensor).
    • 3-wire RTD connection supports long cables while maintaining temperature accuracy during rapid heating.
    • The entire sensor is rated to operate up to at least 125ºC (257ºF).
    • Readings as fast as every 10 seconds for each of the 9 sensors.
    • Field replaceable batteries.
    • Data logging capability when the transceiver node is not linked to a gateway.
        Part of the breakthrough Leap Sensors® system.   Build your quote here:
  • This specially-designed wireless temperature sensor has 9 precision RTDs. The entire transceiver node can operate up to 250ºC (482ºF) - the highest-temperature-rated enclosure we offer. The node is less than 1 inch (2.5 cm) thick - able to ride on a wafer or circuit board through a reflow oven. For wafer temperature monitoring, RTD sensors are ultra-thin and small for a fast response to temperature changes. For other applications, virtually any other RTD sensor can be integrated, including pointed insertion probes for meat or food processing. 3-wire configuration on RTDs assures extra accuracy and immunity to the high-temperature environments. Sensor cable lengths can be made to order. Part of the breakthrough Leap Sensors® system.   Build your quote here:
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